Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 056442/0296 | |
| Pages: | 6 |
| | Recorded: | 06/01/2021 | | |
Attorney Dkt #: | BUR920050100US1 |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY DATA NAME PREVIOUSLY RECORDED AT REEL: 018220 FRAME: 0640. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/06/2009
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Application #:
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11530116
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Filing Dt:
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09/08/2006
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Publication #:
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Pub Dt:
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03/13/2008
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Title:
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DIELECTRIC LAYERS FOR METAL LINES IN SEMICONDUCTOR CHIPS
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Assignee
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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Correspondence name and address
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IBM CORPORATION
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22 CENTURY HILL DRIVE
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SUITE 302
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LATHAM, NY 12110
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