Patent Assignment Details
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| Reel/Frame: | 012998/0297 | |
| Pages: | 3 |
| | Recorded: | 06/17/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/08/2004
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Application #:
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10130223
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Filing Dt:
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08/05/2002
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Title:
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USE OF POLYIMIDE FOR ADHESIVE LAYERS, LITHOGRAPHIC METHOD FOR PRODUCING MICROCOMPONENTS AND METHOD FOR PRODUCING COMPOSITE MATERIAL
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Assignee
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| CARL-ZEISS-STRASSE 18-20 |
| MAINZ, GERMANY 55129 |
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Correspondence name and address
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HUDAK & SHUNK CO., L.P.A.
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DANIEL J. HUDAK, JR.
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7 WEST BOWERY STREET
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SUITE 808
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AKRON, OH 44308-1133
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