Total properties:
39
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10442613
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Filing Dt:
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05/21/2003
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Publication #:
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Pub Dt:
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04/15/2004
| | | | |
Title:
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CMOS image sensors
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Patent #:
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Issue Dt:
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05/24/2005
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Application #:
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10442898
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Filing Dt:
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05/21/2003
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Publication #:
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Pub Dt:
|
04/01/2004
| | | | |
Title:
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CMOS IMAGE SENSOR
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Patent #:
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Issue Dt:
|
04/22/2008
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Application #:
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10627057
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Filing Dt:
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07/25/2003
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Publication #:
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Pub Dt:
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04/08/2004
| | | | |
Title:
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RF SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME
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Patent #:
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Issue Dt:
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12/14/2004
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Application #:
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10663412
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Filing Dt:
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09/16/2003
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Publication #:
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Pub Dt:
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05/20/2004
| | | | |
Title:
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SEMICONDUCTOR DEVICES AND METHODS FOR FORMING SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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01/23/2007
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Application #:
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10712740
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Filing Dt:
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11/13/2003
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Publication #:
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Pub Dt:
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07/01/2004
| | | | |
Title:
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METHOD FOR FORMING A CONTACT USING A DUAL DAMASCENE PROCESS IN SEMICONDUCTOR FABRICATION
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10712945
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Filing Dt:
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11/13/2003
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Publication #:
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Pub Dt:
|
07/01/2004
| | | | |
Title:
|
Stacked hybrid metal line structures including aluminum-copper-alloy
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Patent #:
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Issue Dt:
|
06/28/2005
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Application #:
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10721978
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Filing Dt:
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11/25/2003
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Publication #:
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Pub Dt:
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07/01/2004
| | | | |
Title:
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METHOD OF FORMING A CONTACT IN A SEMICONDUCTOR DEVICE UTILIZING A PLASMA TREATMENT
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|
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Patent #:
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Issue Dt:
|
11/22/2005
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Application #:
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10722825
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Filing Dt:
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11/26/2003
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Publication #:
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Pub Dt:
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07/01/2004
| | | | |
Title:
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SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
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|
|
Patent #:
|
|
Issue Dt:
|
10/10/2006
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Application #:
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10745855
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Filing Dt:
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12/26/2003
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Publication #:
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Pub Dt:
|
07/15/2004
| | | | |
Title:
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METHODS OF MANUFACTURING MOSFETS IN SEMICONDUCTOR DEVICES
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|
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Patent #:
|
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Issue Dt:
|
06/05/2007
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Application #:
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10746652
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Filing Dt:
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12/26/2003
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Publication #:
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Pub Dt:
|
07/15/2004
| | | | |
Title:
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METHODS OF FORMING METAL LINES IN SEMICONDUCTOR DEVICES
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|
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Patent #:
|
|
Issue Dt:
|
10/19/2004
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Application #:
|
10746802
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Filing Dt:
|
12/26/2003
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Publication #:
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Pub Dt:
|
07/22/2004
| | | | |
Title:
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METHODS OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICES
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|
|
Patent #:
|
|
Issue Dt:
|
09/14/2004
|
Application #:
|
10747595
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Filing Dt:
|
12/29/2003
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Publication #:
|
|
Pub Dt:
|
07/22/2004
| | | | |
Title:
|
METHODS FOR MANUFACTURING A SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/05/2005
|
Application #:
|
10748025
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Filing Dt:
|
12/30/2003
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Title:
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METHODS OF MANUFACTURING TRANSISTORS USING DUMMY GATE PATTERNS
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|
|
Patent #:
|
|
Issue Dt:
|
06/07/2005
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Application #:
|
10748428
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Filing Dt:
|
12/30/2003
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Publication #:
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|
Pub Dt:
|
10/21/2004
| | | | |
Title:
|
SIDE BRAZE PACKAGES
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|
|
Patent #:
|
|
Issue Dt:
|
02/14/2006
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Application #:
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10748466
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Filing Dt:
|
12/30/2003
|
Publication #:
|
|
Pub Dt:
|
08/05/2004
| | | | |
Title:
|
METHOD OF MANUFACTURING MOSFET HAVING A FINE GATE WIDTH WITH IMPROVEMENT OF SHORT CHANNEL EFFECT
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|
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Patent #:
|
|
Issue Dt:
|
03/28/2006
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Application #:
|
10748468
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Filing Dt:
|
12/30/2003
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Publication #:
|
|
Pub Dt:
|
08/05/2004
| | | | |
Title:
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METHODS FOR FORMING SHALLOW TRENCH ISOLATION STRUCTURES
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|
|
Patent #:
|
|
Issue Dt:
|
11/01/2005
|
Application #:
|
10749485
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Filing Dt:
|
12/30/2003
|
Publication #:
|
|
Pub Dt:
|
11/04/2004
| | | | |
Title:
|
METHOD FOR FORMING METAL LINES IN A SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/17/2006
|
Application #:
|
10749541
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Filing Dt:
|
12/30/2003
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Publication #:
|
|
Pub Dt:
|
02/17/2005
| | | | |
Title:
|
SEMICONDUCTOR TRANSISTORS AND METHODS OF FABRICATING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
05/10/2005
|
Application #:
|
10749635
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Filing Dt:
|
12/30/2003
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Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
Title:
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PLASMA IGNITION METHOD AND APPARATUS
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|
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Patent #:
|
|
Issue Dt:
|
04/18/2006
|
Application #:
|
10749647
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Filing Dt:
|
12/30/2003
|
Publication #:
|
|
Pub Dt:
|
08/05/2004
| | | | |
Title:
|
METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
10/18/2005
|
Application #:
|
10750245
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Filing Dt:
|
12/31/2003
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Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
Title:
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METHODS FOR FORMING A GATE IN A SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/09/2007
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Application #:
|
10750246
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Filing Dt:
|
12/31/2003
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Publication #:
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Pub Dt:
|
03/03/2005
| | | | |
Title:
|
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES HAVING CAPACITORS
|
|
|
Patent #:
|
|
Issue Dt:
|
02/26/2008
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Application #:
|
10750248
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Filing Dt:
|
12/31/2003
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Publication #:
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|
Pub Dt:
|
04/21/2005
| | | | |
Title:
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INORGANIC COMPOUND FOR REMOVING POLYMERS IN SEMICONDUCTOR PROCESSES
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|
|
Patent #:
|
|
Issue Dt:
|
02/14/2006
|
Application #:
|
10750251
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Filing Dt:
|
12/31/2003
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Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
Title:
|
METHODS OF FABRICATING SILICON ON INSULATOR SUBSTRATES FOR USE IN SEMICONDUCTOR DEVICES
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|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
10750489
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Filing Dt:
|
12/31/2003
|
Publication #:
|
|
Pub Dt:
|
02/10/2005
| | | | |
Title:
|
Methods of manufacturing metal-insulator-metal capacitors of high capacitance in semiconductor devices
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|
|
Patent #:
|
|
Issue Dt:
|
04/19/2005
|
Application #:
|
10751169
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Filing Dt:
|
12/30/2003
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
Title:
|
METHOD FOR FORMING A DUAL DAMASCENE STRUCTURE IN A SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/07/2006
|
Application #:
|
10751175
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Filing Dt:
|
12/30/2003
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
Title:
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SEMICONDUCTOR PACKAGE WITH A HEAT SPREADER
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|
|
Patent #:
|
|
Issue Dt:
|
09/27/2005
|
Application #:
|
10751183
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Filing Dt:
|
12/30/2003
|
Publication #:
|
|
Pub Dt:
|
11/18/2004
| | | | |
Title:
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SEMICONDUCTOR PACKAGE AND STRUCTURE THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
05/30/2006
|
Application #:
|
10751184
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Filing Dt:
|
12/30/2003
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
Title:
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METHOD FOR ETCHING A METAL LAYER IN A SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/08/2006
|
Application #:
|
10751198
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Filing Dt:
|
12/30/2003
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
Title:
|
METHOD FOR PACKAGING A MULTI-CHIP MODULE OF A SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/11/2005
|
Application #:
|
10751199
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Filing Dt:
|
12/30/2003
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
Title:
|
METHOD FOR PACKAGING A SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/10/2006
|
Application #:
|
10751200
|
Filing Dt:
|
12/30/2003
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
Title:
|
METHOD FOR PACKAGING A MULTI-CHIP MODULE OF A SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/04/2005
|
Application #:
|
10751209
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Filing Dt:
|
12/30/2003
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
Title:
|
CERAMIC PACKAGING METHOD EMPLOYING FLIP-CHIP BONDING
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|
|
Patent #:
|
|
Issue Dt:
|
06/12/2007
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Application #:
|
10751212
|
Filing Dt:
|
12/30/2003
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
Title:
|
METHOD FOR PACKAGING A SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/26/2006
|
Application #:
|
10764637
|
Filing Dt:
|
01/26/2004
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
Title:
|
METHODS FOR FORMING A DEVICE ISOLATING BARRIER AND METHODS FOR FORMING A GATE ELECTRODE USING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
04/22/2008
|
Application #:
|
10764905
|
Filing Dt:
|
01/26/2004
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
Title:
|
METHODS FOR FORMING A METAL LINE IN A SEMICONDUCTOR MANUFACTURING PROCESS
|
|
|
Patent #:
|
|
Issue Dt:
|
03/20/2007
|
Application #:
|
10765027
|
Filing Dt:
|
01/26/2004
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
Title:
|
METHODS OF MANUFACTURING MOSFET DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
07/22/2008
|
Application #:
|
10956311
|
Filing Dt:
|
09/30/2004
|
Publication #:
|
|
Pub Dt:
|
06/30/2005
| | | | |
Title:
|
METHODS FOR FORMING A FIELD EFFECT TRANSISTOR
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11115516
|
Filing Dt:
|
04/27/2005
|
Publication #:
|
|
Pub Dt:
|
08/25/2005
| | | | |
Title:
|
Semiconductor devices and methods to form a contact in a semiconductor device
|
|