Patent Assignment Details
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| Reel/Frame: | 050983/0299 | |
| Pages: | 5 |
| | Recorded: | 11/12/2019 | | |
| Attorney Dkt #: | 13496.0074FP01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/17/2019
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Application #:
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15718919
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Filing Dt:
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09/28/2017
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Publication #:
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Pub Dt:
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06/07/2018
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Title:
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PACKAGING STRUCTURES FOR METALLIC BONDING BASED OPTO-ELECTRONIC DEVICE AND MANUFACTURING METHODS THEREOF
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Assignees
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| NO.1, TSINGHUA YUAN |
| HAIDIAN DISTRICT, BEIJING, CHINA 100084 |
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| 2ND FLOOR, BLOCK A, TONGFANG BUILDING |
| SHUANGQINGLU |
| HAIDIAN DISTRICT, BEIJING, CHINA 100084 |
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Correspondence name and address
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TONG WU
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P.O. BOX 2903
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MERCHANT & GOULD P.C.
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MINNEAPOLIS, MN 55402
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