Patent Assignment Details
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| Reel/Frame: | 023964/0302 | |
| Pages: | 4 |
| | Recorded: | 02/19/2010 | | |
| Attorney Dkt #: | UNT-0010 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/21/2013
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Application #:
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12708943
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Filing Dt:
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02/19/2010
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Publication #:
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Pub Dt:
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01/13/2011
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Title:
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WAFER-LEVEL PACKAGE STRUCTURE OF LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF
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Assignee
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| 11B/C, SUCHUN INDUSTRIAL SQUARE, 428 XINGLONG STREET, SUZHOU INDUSTRIAL PARK, |
| JIANG SU PROVINCE, CHINA 215126 |
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Correspondence name and address
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CANTOR COLBURN, LLP
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20 CHURCH STREET
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22ND FLOOR
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HARTFORD, CT 06103
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