Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 025418/0305 | |
| Pages: | 3 |
| | Recorded: | 11/24/2010 | | |
| Attorney Dkt #: | 374611-000036 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/06/2013
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Application #:
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12919717
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Filing Dt:
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11/24/2010
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Publication #:
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Pub Dt:
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03/10/2011
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Title:
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Wafer Support Member, Method for Manufacturing the Same and Electrostatic Chuck Using the Same
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Assignee
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| 6, TAKEDA TOBADONO-CHO, FUSHIMI-KU |
| KYOTO-SHI, KYOTO, JAPAN 612-8501 |
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Correspondence name and address
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DLA PIPER LLP (US)
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1999 AVENUE OF THE STARS
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SUITE 400
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LOS ANGELES, CA 90067
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