Patent Assignment Details
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| Reel/Frame: | 040542/0305 | |
| Pages: | 3 |
| | Recorded: | 11/01/2016 | | |
| Attorney Dkt #: | SILG2015P88US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/10/2017
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Application #:
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15340518
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Filing Dt:
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11/01/2016
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Publication #:
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Pub Dt:
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06/01/2017
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Title:
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CHIP PACKAGE METHOD FOR REDUCING CHIP LEAKAGE CURRENT
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Assignee
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| A1501 TECHNOLOGY MANSION, NO. 90 WENSAN ROAD |
| HANGZHOU, ZHEJIANG PROVINCE, CHINA 310012 |
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Correspondence name and address
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MICHAEL C. STEPHENS, JR.
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22779 MONTROSE COURT
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LOS GATOS, CA 95033
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05/24/2024 10:49 AM
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