Patent Assignment Details
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| Reel/Frame: | 062280/0305 | |
| Pages: | 6 |
| | Recorded: | 01/04/2023 | | |
| Attorney Dkt #: | 2020-4387/24061.4360US02 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE FROM TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. TO TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. PREVIOUSLY RECORDED AT REEL: 062157 FRAME: 0070. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/28/2024
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Application #:
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18068687
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Filing Dt:
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12/20/2022
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Publication #:
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Pub Dt:
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04/20/2023
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Title:
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SOURCE/DRAIN EPI STRUCTURE FOR IMPROVING CONTACT QUALITY
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Assignee
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU SCIENCE, TAIWAN 300-78 |
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Correspondence name and address
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HAYNES AND BOONE, LLP
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2323 VICTORY AVENUE
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DALLAS, TX 75219
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05/29/2024 05:40 PM
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