Patent Assignment Details
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Reel/Frame: | 062058/0308 | |
| Pages: | 4 |
| | Recorded: | 12/12/2022 | | |
Attorney Dkt #: | 1111-016096-US(PAR) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18064517
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Filing Dt:
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12/12/2022
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Publication #:
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Pub Dt:
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10/05/2023
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Title:
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SEMICONDUCTOR PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE SUBSTRATE
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Assignee
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726, UNGNAM-RO, SEONGSAN-GU, CHANGWON-SI, |
GYEONGSANGNAM-DO, KOREA, REPUBLIC OF 51552 |
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Correspondence name and address
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PERMAN & GREEN, LLP
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99 HAWLEY LANE
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STRATFORD, CT 06614
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06/14/2024 09:18 AM
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