Patent Assignment Details
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| Reel/Frame: | 011085/0309 | |
| Pages: | 2 |
| | Recorded: | 09/07/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/17/2004
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Application #:
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09656843
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Filing Dt:
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09/07/2000
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Title:
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FLIP-CHIP BUMBING METHOD FOR FABRICATING SOLDER BUMPS ON SEMICONDUCTOR WAFER
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Assignee
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| NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
| TAICHUNG, TAIWAN R.O.C |
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Correspondence name and address
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DIKE, BRONSTEIN, ROBERTS & CUSHMAN
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PETER F. CORLESS
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130 WATER STREET
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BOSTON, MA 02109
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