Patent Assignment Details
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| Reel/Frame: | 026468/0309 | |
| Pages: | 3 |
| | Recorded: | 06/17/2011 | | |
| Attorney Dkt #: | 95781.10040 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/29/2013
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Application #:
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13140637
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Filing Dt:
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06/17/2011
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Publication #:
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Pub Dt:
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10/13/2011
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Title:
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PROCESS FOR THE WAFER-SCALE FABRICATION OF ELECTRONIC MODULES FOR SURFACE MOUNTING
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Assignee
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| 641 RUE HELENE BOUCHER, Z.I. |
| BUC CEDEX, FRANCE 78532 |
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Correspondence name and address
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BAKER & HOSTETLER LLP
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WASHINGTON SQUARE, SUITE 1100
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1050 CONNECTICUT AVE. N.W.
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WASHINGTON, DC 20036-5304
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