Patent Assignment Details
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| Reel/Frame: | 049995/0310 | |
| Pages: | 8 |
| | Recorded: | 08/07/2019 | | |
| Attorney Dkt #: | MTKP3396USA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/02/2021
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Application #:
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16535019
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Filing Dt:
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08/07/2019
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Publication #:
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Pub Dt:
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02/20/2020
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Title:
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SEMICONDUCTOR PACKAGE WITH REDUCED NOISE
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Assignee
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| NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN |
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Correspondence name and address
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WINSTON HSU
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5F., NO.389, FUHE RD., YONGHE DIST.,
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NEW TAIPEI CITY, TAIWAN
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05/30/2024 07:09 PM
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