Patent Assignment Details
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| Reel/Frame: | 021168/0311 | |
| Pages: | 2 |
| | Recorded: | 06/30/2008 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12213217
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Filing Dt:
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06/17/2008
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Publication #:
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Pub Dt:
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09/17/2009
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Title:
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Semiconductor package structure, lead frame and conductive assembly for the same
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Assignees
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| NO. 25, GUANGPU WEST ROAD |
| GUANGZHOU SCIENCE PARK, GUANGZHOU HIGH AND NEW TECHNOLOGY INDUSTRY DEVELOPMENT ZONE |
| GUANGZHOU, CHINA P.R.C. |
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| 22F, NO. 392, RUEY KUANG ROAD |
| NEI-HU DIST. |
| TAIPEI, TAIWAN R.O.C. |
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Correspondence name and address
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ROSENBERG, KLEIN & LEE
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3458 ELLICOTT CENTER DRIVE-SUITE 101
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ELLICOTT CITY, MD 21043
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