Patent Assignment Details
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Reel/Frame: | 053094/0311 | |
| Pages: | 4 |
| | Recorded: | 06/30/2020 | | |
Attorney Dkt #: | 60122/BY20EX1167FBPE-US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/05/2022
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Application #:
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16917155
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Filing Dt:
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06/30/2020
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Publication #:
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Pub Dt:
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11/11/2021
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Title:
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Semiconductor Package Including Workpiece and Method for Fabricating the Semiconductor Package
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Assignees
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889 HUIQING RD., |
PUDONG NEW DISTRICT |
SHANGHAI, CHINA 201201 |
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3388TH HUANING RD., |
MINHANG DISTRICT |
SHANGHAI, CHINA 201108 |
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Correspondence name and address
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MILLER, MATTHIAS & HULL LLP
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ONE NORTH FRANKLIN STREET
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SUITE 2350
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CHICAGO, IL 60606
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