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Reel/Frame:044562/0312   Pages: 3
Recorded: 01/08/2018
Attorney Dkt #:1012-2014 / 2017P51582 US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/17/2019
Application #:
15832336
Filing Dt:
12/05/2017
Publication #:
Pub Dt:
06/06/2019
Title:
Package-in-Package Structure for Semiconductor Devices and Methods of Manufacture
Assignors
1
Exec Dt:
12/06/2017
2
Exec Dt:
12/11/2017
Assignee
1
AM CAMPEON 1-12
NEUBIBERG, GERMANY 85579
Correspondence name and address
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518

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