Patent Assignment Details
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| Reel/Frame: | 007267/0316 | |
| Pages: | 4 |
| | Recorded: | 12/02/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/22/1997
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Application #:
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08348427
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Filing Dt:
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12/02/1994
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Title:
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SINGLE ALLOY SOLDER CLAD SUBSTRATE
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Assignee
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| 1303 E. ALGONQUIN ROAD |
| SCHAUMBURG, ILLINOIS 60196 |
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Correspondence name and address
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MOTOROLA, INC.
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DALE W. DORINSKI
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PATENT DEPARTMENT
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8000 W. SUNRISE BOULEVARD
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FT. LAUDERDALE, FLORIDA 33322
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