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Reel/Frame:064681/0318   Pages: 4
Recorded: 08/23/2023
Attorney Dkt #:0118/0697PUS1
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18275536
Filing Dt:
08/02/2023
Publication #:
Pub Dt:
02/01/2024
Title:
THREE-DIMENSIONAL INTEGRATED CIRCUIT MODULE AND FABRICATION METHOD THEREFOR
Assignors
1
Exec Dt:
03/06/2023
2
Exec Dt:
03/06/2023
3
Exec Dt:
03/06/2023
4
Exec Dt:
03/06/2023
Assignee
1
NO. 18 GAOXIN 4TH ROAD, DONGHU DEVELOPMENT ZONE
WUHAN, HUBEI, CHINA 430205
Correspondence name and address
MUNCY, GEISSLER, OLDS & LOWE, PC
125 S. ROYAL ST.
ALEXANDRIA, VA 22314

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