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Reel/Frame:038176/0321   Pages: 5
Recorded: 04/01/2016
Attorney Dkt #:2515.0485
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/13/2018
Application #:
15089151
Filing Dt:
04/01/2016
Publication #:
Pub Dt:
10/13/2016
Title:
Double-Sided Semiconductor Package and Dual-Mold Method of Making Same
Assignors
1
Exec Dt:
03/31/2016
2
Exec Dt:
03/31/2016
3
Exec Dt:
03/31/2016
Assignee
1
10 ANG MO KIO STREET 65
TECHPOINT #04-08/09
SINGAPORE, SINGAPORE 569059
Correspondence name and address
PATENT LAW GROUP: ATKINS AND ASSOCIATES
55 N. ARIZONA PLACE
SUITE 104
CHANDLER, AZ 85225

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