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Reel/Frame:020051/0323   Pages: 3
Recorded: 11/01/2007
Attorney Dkt #:APPE-001/01US 308721-2001
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
11784275
Filing Dt:
04/05/2007
Publication #:
Pub Dt:
12/13/2007
Title:
Method and equipment for wafer bonding
Assignor
1
Exec Dt:
09/14/2007
Assignee
1
UNIT 8, LIBRARY AVENUE
HARWELL INTERNATIONAL BUSINESS CENTRE
DIDCOT, OXFORDSHIRE, UNITED KINGDOM OX11 0SG
Correspondence name and address
COOLEY GODWARD KRONISH LLP
777 6TH STREET, NW
SUITE 1100
WASHINGTON, DC 20001

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