Patent Assignment Details
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| Reel/Frame: | 057512/0323 | |
| Pages: | 9 |
| | Recorded: | 09/17/2021 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/26/2021
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Application #:
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16882301
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Filing Dt:
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05/22/2020
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Publication #:
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Pub Dt:
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12/10/2020
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Title:
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THREE-DIMENSIONAL INTEGRATED PACKAGE DEVICE FOR HIGH-VOLTAGE SILICON CARBIDE POWER MODULE
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Assignee
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| NO.28, XIANNING WEST ROAD |
| XI'AN, SHAANXI, CHINA |
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Correspondence name and address
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QIANQIAN WU
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64 BANK ST
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ABINGTON, MA 02351
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05/30/2024 12:28 PM
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