Patent Assignment Details
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| Reel/Frame: | 012560/0325 | |
| Pages: | 2 |
| | Recorded: | 01/30/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09891324
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Filing Dt:
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06/27/2001
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Publication #:
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Pub Dt:
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01/02/2003
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Title:
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Process for high-dielectric constant metal-insulator metal capacitor in VLSI multi-level metallization systems
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Assignee
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| INTELLECTUAL PROPERTY ADMINISTRATION |
| P.O. BOX 272400 |
| FORT COLLINS, COLORADO 80527 |
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Correspondence name and address
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HEWLETT-PACKARD COMPANY
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ANN JESUS
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RECORDS MANAGER
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1501 PAGE MILL ROAD M/S 4U-10
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PALO ALTO, CA 94304
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