Patent Assignment Details
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| Reel/Frame: | 007494/0327 | |
| Pages: | 4 |
| | Recorded: | 05/11/1995 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/19/1997
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Application #:
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08439022
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Filing Dt:
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05/11/1995
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Title:
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METHOD TO FORM HEMISPHERICAL GRAIN (HSG) SILICON BY IMPLANT SEEDING FOLLOWED BY VACUUM ANNEAL
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Assignee
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| MAIL STOP 525, PATENT DEPARTMENT |
| 2805 E. COLUMBIA ROAD |
| BOISE, IDAHO 83706 |
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Correspondence name and address
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DAVID J. PAUL
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MICRON TECHNOLOGY, INC.
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MAIL STOP 525, PAT. DEPT
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2805 E. COLUMBIA RD.
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BOISE, ID 83706
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