Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 047516/0327 | |
| Pages: | 5 |
| | Recorded: | 11/15/2018 | | |
| Attorney Dkt #: | 104P000243US.CA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/19/2020
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Application #:
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16192111
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Filing Dt:
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11/15/2018
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Publication #:
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Pub Dt:
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03/21/2019
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Title:
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LED PACKAGE STRUCTURE AND MULTILAYER CIRCUIT BOARD
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Assignees
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| NO.88, YANGHU ROAD, WUJIN HI-TECH INDUSTRIAL DEVELOPMENT ZONE |
| CHANGZHOU CITY,JIANGSU PROVINCE, CHINA |
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| 22F., NO. 392, RUEY KUANG ROAD, NEIHU DIST. |
| TAIPEI CITY, TAIWAN 114 |
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Correspondence name and address
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LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE
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3057 NUTLEY STREET
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SUITE 818
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FAIRFAX, VA 22031
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05/26/2024 02:31 PM
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