Patent Assignment Details
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| Reel/Frame: | 018648/0328 | |
| Pages: | 2 |
| | Recorded: | 12/18/2006 | | |
| Attorney Dkt #: | 50020/50001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11612008
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Filing Dt:
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12/18/2006
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Publication #:
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Pub Dt:
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06/21/2007
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Title:
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Silicon Wafer Grinding Apparatus, Retaining Assembly Used for the Same and Silicon Wafer Flatness Correcting Method
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Assignee
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| 274 IMSU-DONG |
| GUMI-SI GYEONGSANGBUK-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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MILLER MATTHIAS & HULL
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ONE NORTH FRANKLIN
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SUITE 2350
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CHICAGO, IL 60606
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