Patent Assignment Details
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| Reel/Frame: | 014058/0329 | |
| Pages: | 4 |
| | Recorded: | 05/06/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10430970
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Filing Dt:
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05/06/2003
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Publication #:
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Pub Dt:
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11/11/2004
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Title:
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Method and pallet assembly for reflow soldering of interconnections between printed circuits having low-temperature substrates
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Assignee
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| 1 PARKLANE BLVD. SUITE 728 |
| PARKLANE TOWER EAST |
| DEARBORN, MICHIGAN 48126 |
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Correspondence name and address
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BRINKS HOFER GILSON
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HUGO A. DELEVIE, ESQ.
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P.O. BOX 10395
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CHICAGO, IL 60610
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06/07/2024 03:31 AM
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