Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 060735/0330 | |
| Pages: | 3 |
| | Recorded: | 08/05/2022 | | |
| Attorney Dkt #: | MRSI004-US2_MJC |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/17/2023
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Application #:
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17782520
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Filing Dt:
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06/03/2022
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Publication #:
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Pub Dt:
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05/11/2023
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Title:
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DIE BONDING SYSTEM WITH WAFER LIFT AND LEVEL ASSEMBLY
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Assignee
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| 554 CLARK ROAD |
| TWEKSBURY, MASSACHUSETTS 01876 |
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Correspondence name and address
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MAINE CERNOTA & RARDIN
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547 AMHERST ST., 3RD FLOOR
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NASHUA, NH 03063
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05/23/2024 08:53 PM
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