Patent Assignment Details
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| Reel/Frame: | 011696/0334 | |
| Pages: | 7 |
| | Recorded: | 04/09/2001 | | |
| Conveyance: | CERTIFICATE OF AMENDMENT |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/21/2003
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Application #:
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09354291
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Filing Dt:
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07/15/1999
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Publication #:
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Pub Dt:
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10/31/2002
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Title:
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LIQUID TRANSFER MOLDING SYSTEM FOR ENCAPSULATING SEMICONDUCTOR INTEGRATED CIRCUITS
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Assignee
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| INTELLCTUAL PROPERTY DEPARTMENT |
| 1730 NORTH FIRST STREET |
| SAN JOSE, CALIFORNIA 95112 |
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Correspondence name and address
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SIEMENS CORPORATION
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ELSA KELLER
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INTELLECTUAL PROPERTY DEPARTMENT
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186 WOOD AVENUE SOUTH
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ISELIN, NJ 08830
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