Patent Assignment Details
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| Reel/Frame: | 052130/0335 | |
| Pages: | 14 |
| | Recorded: | 03/17/2020 | | |
| Attorney Dkt #: | NAUP3580USA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/31/2021
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Application #:
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16820730
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Filing Dt:
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03/17/2020
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Publication #:
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Pub Dt:
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08/19/2021
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Title:
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Method of fabricating semiconductor device
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Assignee
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| NO.899 WAN JIA CHUN ROAD, XIAMEN XIANG'AN |
| XIAMEN, FUJIAN, CHINA |
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Correspondence name and address
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WINSTON HSU
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5F., NO.389, FUHE RD., YONGHE DIST.,
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NEW TAIPEI CITY, TAIWAN
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05/24/2024 07:12 AM
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