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Reel/Frame:061597/0338   Pages: 11
Recorded: 10/31/2022
Attorney Dkt #:60753US06
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17977164
Filing Dt:
10/31/2022
Publication #:
Pub Dt:
04/20/2023
Title:
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Assignors
1
Exec Dt:
07/24/2018
2
Exec Dt:
07/30/2018
3
Exec Dt:
07/23/2018
4
Exec Dt:
07/30/2018
5
Exec Dt:
07/23/2018
6
Exec Dt:
07/24/2018
7
Exec Dt:
07/13/2018
8
Exec Dt:
08/09/2018
Assignee
1
2045 E. INNOVATION CIRCLE
TEMPE, ARIZONA 85284
Correspondence name and address
MCANDREWS, HELD & MALLOY, LTD.
500 W. MADISON ST
SUITE 3400
CHICAGO, 60661 UNITED STATES

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