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Patent Assignment Details
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Reel/Frame:012482/0340   Pages: 4
Recorded: 01/08/2002
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/10/2004
Application #:
10038967
Filing Dt:
01/04/2002
Publication #:
Pub Dt:
07/11/2002
Title:
METHODS OF MANUFACTURING INTEGRATED CIRCUIT DEVICES HAVING REDUCED CONTACT RESISTANCE BETWEEN A SUBSTRATE AND A CONTACT PAD WHILE MAINTAINING SEPARATION OF THE SUBSTRATE AND THE CONTACT PAD AND INTEGRATED CIRCUIT DEVICES FORMED THEREBY
Assignors
1
Exec Dt:
12/28/2001
2
Exec Dt:
12/28/2001
3
Exec Dt:
12/28/2001
4
Exec Dt:
12/28/2001
Assignee
1
PALDAL-GU SUWON-CITY
416 MAETAN-DONG
KYUNGKI-DO, KOREA, REPUBLIC OF
Correspondence name and address
MYERS BIGEL SIBLEY ET AL.
D. SCOTT MOORE
P.O. BOX 37428
RALEIGH, NC 27627

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