Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 031263/0341 | |
| Pages: | 116 |
| | Recorded: | 09/10/2013 | | |
| Attorney Dkt #: | 303.000001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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11/28/2006
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Application #:
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10731177
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Filing Dt:
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12/09/2003
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Publication #:
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Pub Dt:
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12/30/2004
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Title:
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WIRE-BONDED PACKAGE WITH ELECTRICALLY INSULATING WIRE ENCAPSULANT AND THERMALLY CONDUCTIVE OVERMOLD
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Patent #:
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Issue Dt:
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11/28/2006
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Application #:
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10731177
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Filing Dt:
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12/09/2003
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Publication #:
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Pub Dt:
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12/30/2004
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Title:
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WIRE-BONDED PACKAGE WITH ELECTRICALLY INSULATING WIRE ENCAPSULANT AND THERMALLY CONDUCTIVE OVERMOLD
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Assignee
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| 8000 SO. FEDERAL WAY |
| BOISE, IDAHO USA 83716-9632 |
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Correspondence name and address
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MARK V. MULLER
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SCHWEGMAN, LUNDBERG & WOESSNER, P.A.
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P.O. BOX 2938
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MINNEAPOLIS, MN 55402-0938
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