Patent Assignment Details
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Reel/Frame: | 018119/0349 | |
| Pages: | 3 |
| | Recorded: | 08/02/2006 | | |
Attorney Dkt #: | LAYMAN 22-12/075903-484 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11392375
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Filing Dt:
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03/29/2006
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Publication #:
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Pub Dt:
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07/27/2006
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Title:
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High-density inter-die interconnect structure
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Assignee
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14645.W. 77TH AVENUE |
SUITE 105 |
MIAMI LAKES, FLORIDA 33014 |
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Correspondence name and address
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STEVE MENDELSOHN
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MENDELSOHN & ASSOCIATES, P.C.
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1500 JOHN F. KENNEDY BLVD.
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SUITE 405
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PHILADELPHIA, PA 19102
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06/09/2024 01:05 AM
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