Patent Assignment Details
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Reel/Frame: | 038082/0349 | |
| Pages: | 2 |
| | Recorded: | 03/14/2016 | | |
Attorney Dkt #: | PA2714-0 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/28/2017
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Application #:
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15069615
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Filing Dt:
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03/14/2016
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Title:
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FLEXIBLE PACKAGES INCLUDING CHIPS
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Assignee
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2091, GYEONGCHUNG-DAERO, BUBAL-EUB |
ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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WILLIAM PARK & ASSOCIATES LTD.
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930 N. YORK ROAD, SUITE 201
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HINSDALE, IL 60521
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