Patent Assignment Details
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| Reel/Frame: | 039261/0350 | |
| Pages: | 3 |
| | Recorded: | 07/26/2016 | | |
| Attorney Dkt #: | Q225971 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/24/2017
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Application #:
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15219803
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Filing Dt:
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07/26/2016
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Publication #:
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Pub Dt:
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11/17/2016
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Title:
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MICROSTRUCTURE, MULTILAYER WIRING BOARD, SEMICONDUCTOR PACKAGE AND MICROSTRUCTURE MANUFACTURING METHOD
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Assignee
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| 26-30, NISHIAZABU 2-CHOME, MINATO-KU |
| TOKYO, JAPAN 106-8620 |
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Correspondence name and address
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SUGHRUE MION PLLC
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2100 PENNSYLVANIA AVE NW
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SUITE 800
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WASHINGTON, DC 20037
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