|
Total properties:
56
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/17/2023
|
Application #:
|
11078265
|
Filing Dt:
|
03/11/2005
|
|
Publication #:
|
|
Pub Dt:
|
09/14/2006
| | | | |
|
Title:
|
Wide bandgap transistors with gate-source field plates
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/30/2023
|
Application #:
|
15696050
|
Filing Dt:
|
09/05/2017
|
|
Publication #:
|
|
Pub Dt:
|
12/21/2017
| | | | |
|
Title:
|
WIDE BANDGAP FIELD EFFECT TRANSISTORS WITH SOURCE CONNECTED FIELD PLATES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
06/11/2024
|
Application #:
|
16367631
|
Filing Dt:
|
03/28/2019
|
|
Publication #:
|
|
Pub Dt:
|
10/01/2020
| | | | |
|
Title:
|
IN-TRANSISTOR LOAD MODULATION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/16/2022
|
Application #:
|
16393280
|
Filing Dt:
|
04/24/2019
|
|
Publication #:
|
|
Pub Dt:
|
10/29/2020
| | | | |
|
Title:
|
HIGH POWER TRANSISTOR WITH INTERIOR-FED FINGERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/01/2022
|
Application #:
|
16421824
|
Filing Dt:
|
05/24/2019
|
|
Publication #:
|
|
Pub Dt:
|
11/26/2020
| | | | |
|
Title:
|
HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/21/2022
|
Application #:
|
16737188
|
Filing Dt:
|
01/08/2020
|
|
Publication #:
|
|
Pub Dt:
|
07/08/2021
| | | | |
|
Title:
|
RADIO FREQUENCY AMPLIFIERS HAVING IMPROVED SHUNT MATCHING CIRCUITS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/28/2022
|
Application #:
|
16751246
|
Filing Dt:
|
01/24/2020
|
|
Publication #:
|
|
Pub Dt:
|
05/21/2020
| | | | |
|
Title:
|
STABILIZED, HIGH-DOPED SILICON CARBIDE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/24/2023
|
Application #:
|
16863399
|
Filing Dt:
|
04/30/2020
|
|
Publication #:
|
|
Pub Dt:
|
11/04/2021
| | | | |
|
Title:
|
TRENCHED POWER DEVICE WITH SEGMENTED TRENCH AND SHIELDING
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
16863642
|
Filing Dt:
|
04/30/2020
|
|
Publication #:
|
|
Pub Dt:
|
11/04/2021
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE HAVING A FIRST BARRIER LAYER FORMED ON A GATE PAD AND GATE ELECTRODE AND AN ISOLATION LAYER PROVIDED BETWEEN THE FIRST BARRIER LAYER AND A SECOND BARRIER LAYER FORMED THEREON
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
16863797
|
Filing Dt:
|
04/30/2020
|
|
Publication #:
|
|
Pub Dt:
|
11/04/2021
| | | | |
|
Title:
|
CONDUCTION ENHANCEMENT LAYERS FOR ELECTRICAL CONTACT REGIONS IN POWER DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/07/2022
|
Application #:
|
16888957
|
Filing Dt:
|
06/01/2020
|
|
Publication #:
|
|
Pub Dt:
|
12/02/2021
| | | | |
|
Title:
|
RF AMPLIFIERS HAVING SHIELDED TRANSMISSION LINE STRUCTURES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/26/2023
|
Application #:
|
16889432
|
Filing Dt:
|
06/01/2020
|
|
Publication #:
|
|
Pub Dt:
|
12/02/2021
| | | | |
|
Title:
|
METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEGRATION ON BACKSIDE OF DIE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/06/2023
|
Application #:
|
16906610
|
Filing Dt:
|
06/19/2020
|
|
Publication #:
|
|
Pub Dt:
|
10/07/2021
| | | | |
|
Title:
|
RF AMPLIFIER DEVICES INCLUDING INTERCONNECT STRUCTURES AND METHODS OF MANUFACTURING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/07/2023
|
Application #:
|
16907983
|
Filing Dt:
|
06/22/2020
|
|
Publication #:
|
|
Pub Dt:
|
10/08/2020
| | | | |
|
Title:
|
BYPASSED GATE TRANSISTORS HAVING IMPROVED STABILITY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/21/2023
|
Application #:
|
16910900
|
Filing Dt:
|
06/24/2020
|
|
Publication #:
|
|
Pub Dt:
|
12/30/2021
| | | | |
|
Title:
|
RADIO FREQUENCY TRANSISTOR AMPLIFIERS HAVING LEADFRAMES WITH INTEGRATED SHUNT INDUCTORS AND/OR DIRECT CURRENT VOLTAGE SOURCE INPUTS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/20/2022
|
Application #:
|
16911757
|
Filing Dt:
|
06/25/2020
|
|
Publication #:
|
|
Pub Dt:
|
12/30/2021
| | | | |
|
Title:
|
MULTI-ZONE RADIO FREQUENCY TRANSISTOR AMPLIFIERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/06/2022
|
Application #:
|
16913374
|
Filing Dt:
|
06/26/2020
|
|
Publication #:
|
|
Pub Dt:
|
12/30/2021
| | | | |
|
Title:
|
WIDEBAND RF SHORT/DC BLOCK CIRCUIT FOR RF DEVICES AND APPLICATIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/14/2023
|
Application #:
|
16913783
|
Filing Dt:
|
06/26/2020
|
|
Publication #:
|
|
Pub Dt:
|
12/30/2021
| | | | |
|
Title:
|
RADIO FREQUENCY (RF) TRANSISTOR AMPLIFIER PACKAGES WITH IMPROVED ISOLATION AND LEAD CONFIGURATIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/04/2023
|
Application #:
|
16944002
|
Filing Dt:
|
07/30/2020
|
|
Publication #:
|
|
Pub Dt:
|
02/03/2022
| | | | |
|
Title:
|
DIE-TO-DIE ISOLATION STRUCTURES FOR PACKAGED TRANSISTOR DEVICES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
16993680
|
Filing Dt:
|
08/14/2020
|
|
Publication #:
|
|
Pub Dt:
|
02/17/2022
| | | | |
|
Title:
|
SIDEWALL DOPANT SHIELDING METHODS AND APPROACHES FOR TRENCHED SEMICONDUCTOR DEVICE STRUCTURES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/23/2022
|
Application #:
|
16998287
|
Filing Dt:
|
08/20/2020
|
|
Publication #:
|
|
Pub Dt:
|
12/03/2020
| | | | |
|
Title:
|
DRAIN AND/OR GATE INTERCONNECT AND FINGER STRUCTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/12/2023
|
Application #:
|
17004531
|
Filing Dt:
|
08/27/2020
|
|
Publication #:
|
|
Pub Dt:
|
03/03/2022
| | | | |
|
Title:
|
POWER SILICON CARBIDE BASED SEMICONDUCTOR DEVICES WITH IMPROVED SHORT CIRCUIT CAPABILITIES AND METHODS OF MAKING SUCH DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/16/2022
|
Application #:
|
17010479
|
Filing Dt:
|
09/02/2020
|
|
Publication #:
|
|
Pub Dt:
|
12/24/2020
| | | | |
|
Title:
|
PACKAGED TRANSISTOR DEVICES WITH INPUT-OUTPUT ISOLATION AND METHODS OF FORMING PACKAGED TRANSISTOR DEVICES WITH INPUT-OUTPUT ISOLATION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/05/2023
|
Application #:
|
17018721
|
Filing Dt:
|
09/11/2020
|
|
Publication #:
|
|
Pub Dt:
|
03/17/2022
| | | | |
|
Title:
|
PACKAGING FOR RF TRANSISTOR AMPLIFIERS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17018762
|
Filing Dt:
|
09/11/2020
|
|
Publication #:
|
|
Pub Dt:
|
10/07/2021
| | | | |
|
Title:
|
RF AMPLIFIER DEVICES INCLUDING TOP SIDE CONTACTS AND METHODS OF MANUFACTURING
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17031745
|
Filing Dt:
|
09/24/2020
|
|
Publication #:
|
|
Pub Dt:
|
10/07/2021
| | | | |
|
Title:
|
MULTI LEVEL RADIO FREQUENCY (RF) INTEGRATED CIRCUIT COMPONENTS INCLUDING PASSIVE DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/02/2023
|
Application #:
|
17080956
|
Filing Dt:
|
10/27/2020
|
|
Publication #:
|
|
Pub Dt:
|
04/28/2022
| | | | |
|
Title:
|
POWER SEMICONDUCTOR DEVICES INCLUDING A TRENCHED GATE AND METHODS OF FORMING SUCH DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/21/2023
|
Application #:
|
17082647
|
Filing Dt:
|
10/28/2020
|
|
Publication #:
|
|
Pub Dt:
|
04/28/2022
| | | | |
|
Title:
|
GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING IMPROVED DEEP SHIELD CONNECTION PATTERNS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/13/2023
|
Application #:
|
17085367
|
Filing Dt:
|
10/30/2020
|
|
Publication #:
|
|
Pub Dt:
|
05/05/2022
| | | | |
|
Title:
|
RADIO FREQUENCY TRANSISTOR AMPLIFIERS HAVING MULTI-LAYER ENCAPSULATIONS THAT INCLUDE FUNCTIONAL ELECTRICAL CIRCUITS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17085386
|
Filing Dt:
|
10/30/2020
|
|
Publication #:
|
|
Pub Dt:
|
05/05/2022
| | | | |
|
Title:
|
TRANSISTOR PACKAGES WITH IMPROVED DIE ATTACH
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17096147
|
Filing Dt:
|
11/12/2020
|
|
Publication #:
|
|
Pub Dt:
|
05/12/2022
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICES INCLUDING AN OFFSET METAL TO POLYSILICON GATE CONTACT
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17097294
|
Filing Dt:
|
11/13/2020
|
|
Publication #:
|
|
Pub Dt:
|
05/19/2022
| | | | |
|
Title:
|
PACKAGED RF POWER DEVICE WITH PCB ROUTING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/30/2023
|
Application #:
|
17097617
|
Filing Dt:
|
11/13/2020
|
|
Publication #:
|
|
Pub Dt:
|
05/19/2022
| | | | |
|
Title:
|
SEMICONDUCTOR POWER DEVICES HAVING MULTIPLE GATE TRENCHES AND METHODS OF FORMING SUCH DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/16/2023
|
Application #:
|
17103993
|
Filing Dt:
|
11/25/2020
|
|
Publication #:
|
|
Pub Dt:
|
03/18/2021
| | | | |
|
Title:
|
TRANSISTOR LEVEL INPUT AND OUTPUT HARMONIC TERMINATIONS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17108505
|
Filing Dt:
|
12/01/2020
|
|
Publication #:
|
|
Pub Dt:
|
06/02/2022
| | | | |
|
Title:
|
FINFET POWER SEMICONDUCTOR DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/28/2023
|
Application #:
|
17111561
|
Filing Dt:
|
12/04/2020
|
|
Publication #:
|
|
Pub Dt:
|
04/22/2021
| | | | |
|
Title:
|
MONOLITHIC MICROWAVE INTEGRATED CIRCUITS HAVING BOTH ENHANCEMENT-MODE AND DEPLETION MODE TRANSISTORS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/17/2023
|
Application #:
|
17144346
|
Filing Dt:
|
01/08/2021
|
|
Publication #:
|
|
Pub Dt:
|
07/14/2022
| | | | |
|
Title:
|
RADIO FREQUENCY TRANSISTOR AMPLIFIERS HAVING WIDENED AND/OR ASYMMETRIC SOURCE/DRAIN REGIONS FOR IMPROVED ON-RESISTANCE PERFORMANCE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/07/2022
|
Application #:
|
17148688
|
Filing Dt:
|
01/14/2021
|
|
Publication #:
|
|
Pub Dt:
|
05/06/2021
| | | | |
|
Title:
|
HIGH ELECTRON MOBILITY TRANSISTORS HAVING IMPROVED DRAIN CURRENT DRIFT AND/OR LEAKAGE CURRENT PERFORMANCE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/22/2022
|
Application #:
|
17159825
|
Filing Dt:
|
01/27/2021
|
|
Title:
|
BIAS CIRCUITS AND IMPROVED LINEARITY BIAS SCHEMES FOR RF POWER DEVICES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17159925
|
Filing Dt:
|
01/27/2021
|
|
Publication #:
|
|
Pub Dt:
|
07/28/2022
| | | | |
|
Title:
|
PACKAGED ELECTRONIC DEVICES HAVING DIELECTRIC SUBSTRATES WITH THERMALLY CONDUCTIVE ADHESIVE LAYERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/26/2023
|
Application #:
|
17172481
|
Filing Dt:
|
02/10/2021
|
|
Publication #:
|
|
Pub Dt:
|
04/28/2022
| | | | |
|
Title:
|
GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING IMPROVED DEEP SHIELD CONNECTION PATTERNS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/30/2023
|
Application #:
|
17188329
|
Filing Dt:
|
03/01/2021
|
|
Publication #:
|
|
Pub Dt:
|
09/01/2022
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICES HAVING GATE RESISTORS WITH LOW VARIATION IN RESISTANCE VALUES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17190559
|
Filing Dt:
|
03/03/2021
|
|
Publication #:
|
|
Pub Dt:
|
06/24/2021
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICES HAVING UNIT CELL TRANSISTORS WITH SMOOTHED TURN-ON BEHAVIOR AND IMPROVED LINEARITY
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17210660
|
Filing Dt:
|
03/24/2021
|
|
Publication #:
|
|
Pub Dt:
|
10/07/2021
| | | | |
|
Title:
|
STACKED RF CIRCUIT TOPOLOGY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/23/2024
|
Application #:
|
17210674
|
Filing Dt:
|
03/24/2021
|
|
Publication #:
|
|
Pub Dt:
|
10/07/2021
| | | | |
|
Title:
|
STACKED RF CIRCUIT TOPOLOGY USING TRANSISTOR DIE WITH THROUGH SILICON CARBIDE VIAS ON GATE AND/OR DRAIN
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/05/2023
|
Application #:
|
17211281
|
Filing Dt:
|
03/24/2021
|
|
Publication #:
|
|
Pub Dt:
|
10/07/2021
| | | | |
|
Title:
|
GROUP III NITRIDE-BASED RADIO FREQUENCY AMPLIFIERS HAVING BACK SIDE SOURCE, GATE AND/OR DRAIN TERMINALS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/10/2023
|
Application #:
|
17213895
|
Filing Dt:
|
03/26/2021
|
|
Publication #:
|
|
Pub Dt:
|
09/29/2022
| | | | |
|
Title:
|
HIGH OUTPUT POWER DENSITY RADIO FREQUENCY TRANSISTOR AMPLIFIERS IN FLAT NO-LEAD OVERMOLD PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/19/2024
|
Application #:
|
17313567
|
Filing Dt:
|
05/06/2021
|
|
Publication #:
|
|
Pub Dt:
|
11/10/2022
| | | | |
|
Title:
|
OUTPUT-INTEGRATED TRANSISTOR AMPLIFIER DEVICE PACKAGES INCORPORATING INTERNAL CONNECTIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/23/2024
|
Application #:
|
17313616
|
Filing Dt:
|
05/06/2021
|
|
Publication #:
|
|
Pub Dt:
|
11/10/2022
| | | | |
|
Title:
|
OUTPUT-INTEGRATED TRANSISTOR DEVICE PACKAGES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17325488
|
Filing Dt:
|
05/20/2021
|
|
Publication #:
|
|
Pub Dt:
|
11/24/2022
| | | | |
|
Title:
|
TRANSISTORS INCLUDING SEMICONDUCTOR SURFACE MODIFICATION AND RELATED FABRICATION METHODS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17325628
|
Filing Dt:
|
05/20/2021
|
|
Publication #:
|
|
Pub Dt:
|
11/24/2022
| | | | |
|
Title:
|
METHODS OF MANUFACTURING HIGH ELECTRON MOBILITY TRANSISTORS HAVING A MODIFIED INTERFACE REGION
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
06/11/2024
|
Application #:
|
17325765
|
Filing Dt:
|
05/20/2021
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|
Publication #:
|
|
Pub Dt:
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11/24/2022
| | | | |
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Title:
|
HIGH ELECTRON MOBILITY TRANSISTORS HAVING IMPROVED PERFORMANCE
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|
|
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Patent #:
|
NONE
|
Issue Dt:
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|
Application #:
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17335796
|
Filing Dt:
|
06/01/2021
|
|
Publication #:
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|
Pub Dt:
|
12/01/2022
| | | | |
|
Title:
|
MULTILAYER ENCAPSULATION FOR HUMIDITY ROBUSTNESS AND RELATED FABRICATION METHODS
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17340492
|
Filing Dt:
|
06/07/2021
|
|
Publication #:
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|
Pub Dt:
|
12/08/2022
| | | | |
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Title:
|
PACKAGED TRANSISTOR AMPLIFIERS THAT INCLUDE INTEGRATED PASSIVE DEVICE MATCHING STRUCTURES HAVING DISTRIBUTED SHUNT INDUCTANCES
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/12/2023
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Application #:
|
17390020
|
Filing Dt:
|
07/30/2021
|
|
Publication #:
|
|
Pub Dt:
|
02/02/2023
| | | | |
|
Title:
|
ENCAPSULATION STACK FOR IMPROVED HUMIDITY PERFORMANCE AND RELATED FABRICATION METHODS
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17390316
|
Filing Dt:
|
07/30/2021
|
|
Publication #:
|
|
Pub Dt:
|
02/02/2023
| | | | |
|
Title:
|
INTERCONNECT METAL OPENINGS THROUGH DIELECTRIC FILMS
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|
