Patent Assignment Details
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| Reel/Frame: | 016975/0352 | |
| Pages: | 4 |
| | Recorded: | 09/09/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/02/2009
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Application #:
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11223311
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Filing Dt:
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09/09/2005
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Publication #:
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Pub Dt:
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08/10/2006
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Title:
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METHODS FOR FORMING DUAL DAMASCENE WIRING FOR SEMICONDUCTOR DEVICES USING PROTECTIVE VIA CAPPING LAYER
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Assignee
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| 416, MAETAN-DONG, YEONGTONG-GU, KYUNGKI-DO |
| SUWON-CITY, KOREA, REPUBLIC OF |
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Correspondence name and address
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FRANK CHAU
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F. CHAU & ASSOCIATES, LLC
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130 WOODBURY ROAD
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WOODBURY, NY 11797
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