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Patent Assignment Details

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	045658/0353			Pages:	5
		Recorded:	04/27/2018
Conveyance:	RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).

Total properties: 31

Patent #:	7052941	Issue Dt:	05/30/2006	Application #:	10873969	Filing Dt:	06/21/2004
Publication #:	US20040262635	Pub Dt:	12/30/2004
Title:	METHOD FOR MAKING A THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE

Patent #:	7378702	Issue Dt:	05/27/2008	Application #:	10934270	Filing Dt:	09/03/2004
Publication #:	US20050280061	Pub Dt:	12/22/2005
Title:	VERTICAL MEMORY DEVICE STRUCTURES

Patent #:	7470142	Issue Dt:	12/30/2008	Application #:	11092498	Filing Dt:	03/29/2005
Publication #:	US20050280042	Pub Dt:	12/22/2005
Title:	WAFER BONDING METHOD

Patent #:	7470598	Issue Dt:	12/30/2008	Application #:	11092499	Filing Dt:	03/29/2005
Publication #:	US20050282356	Pub Dt:	12/22/2005
Title:	SEMICONDUCTOR LAYER STRUCTURE AND METHOD OF MAKING THE SAME

Patent #:	8018058	Issue Dt:	09/13/2011	Application #:	11092500	Filing Dt:	03/29/2005
Publication #:	US20050280154	Pub Dt:	12/22/2005
Title:	SEMICONDUCTOR MEMORY DEVICE

Patent #:	NONE	Issue Dt:		Application #:	11092501	Filing Dt:	03/29/2005
Publication #:	US20050280155	Pub Dt:	12/22/2005
Title:	Semiconductor bonding and layer transfer method

Patent #:	7633162	Issue Dt:	12/15/2009	Application #:	11092521	Filing Dt:	03/29/2005
Publication #:	US20050218521	Pub Dt:	10/06/2005
Title:	ELECTRONIC CIRCUIT WITH EMBEDDED MEMORY

Patent #:	NONE	Issue Dt:		Application #:	11378059	Filing Dt:	03/17/2006
Publication #:	US20060275962	Pub Dt:	12/07/2006
Title:	Three-dimensional integrated circuit structure and method of making same

Patent #:	7888764	Issue Dt:	02/15/2011	Application #:	11606523	Filing Dt:	11/30/2006
Publication #:	US20070077694	Pub Dt:	04/05/2007
Title:	THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE

Patent #:	NONE	Issue Dt:		Application #:	11873719	Filing Dt:	10/17/2007
Publication #:	US20080048327	Pub Dt:	02/28/2008
Title:	ELECTRONIC CIRCUIT WITH EMBEDDED MEMORY

Patent #:	NONE	Issue Dt:		Application #:	11873769	Filing Dt:	10/17/2007
Publication #:	US20080032463	Pub Dt:	02/07/2008
Title:	SEMICONDUCTOR MEMORY DEVICE

Patent #:	7718508	Issue Dt:	05/18/2010	Application #:	11873851	Filing Dt:	10/17/2007
Publication #:	US20080038902	Pub Dt:	02/14/2008
Title:	SEMICONDUCTOR BONDING AND LAYER TRANSFER METHOD

Patent #:	7800199	Issue Dt:	09/21/2010	Application #:	12040642	Filing Dt:	02/29/2008
Publication #:	US20080191312	Pub Dt:	08/14/2008
Title:	SEMICONDUCTOR CIRCUIT

Patent #:	7671371	Issue Dt:	03/02/2010	Application #:	12165445	Filing Dt:	06/30/2008
Publication #:	US20080265360	Pub Dt:	10/30/2008
Title:	SEMICONDUCTOR LAYER STRUCTURE AND METHOD OF MAKING THE SAME

Patent #:	7846814	Issue Dt:	12/07/2010	Application #:	12165475	Filing Dt:	06/30/2008
Publication #:	US20080261380	Pub Dt:	10/23/2008
Title:	SEMICONDUCTOR LAYER STRUCTURE AND METHOD OF MAKING THE SAME

Patent #:	7632738	Issue Dt:	12/15/2009	Application #:	12345503	Filing Dt:	12/29/2008
Publication #:	US20090111241	Pub Dt:	04/30/2009
Title:	WAFER BONDING METHOD

Patent #:	7863748	Issue Dt:	01/04/2011	Application #:	12397309	Filing Dt:	03/03/2009
Publication #:	US20090224364	Pub Dt:	09/10/2009
Title:	SEMICONDUCTOR CIRCUIT AND METHOD OF FABRICATING THE SAME

Patent #:	8058142	Issue Dt:	11/15/2011	Application #:	12470344	Filing Dt:	05/21/2009
Publication #:	US20090267233	Pub Dt:	10/29/2009
Title:	BONDED SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING THE SAME

Patent #:	7799675	Issue Dt:	09/21/2010	Application #:	12475294	Filing Dt:	05/29/2009
Publication #:	US20090325343	Pub Dt:	12/31/2009
Title:	BONDED SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

Patent #:	8471263	Issue Dt:	06/25/2013	Application #:	12581722	Filing Dt:	10/19/2009
Publication #:	US20100038743	Pub Dt:	02/18/2010
Title:	INFORMATION STORAGE SYSTEM WHICH INCLUDES A BONDED SEMICONDUCTOR STRUCTURE

Patent #:	8471263	Issue Dt:	06/25/2013	Application #:	12581722	Filing Dt:	10/19/2009
Publication #:	US20100038743	Pub Dt:	02/18/2010
Title:	INFORMATION STORAGE SYSTEM WHICH INCLUDES A BONDED SEMICONDUCTOR STRUCTURE

Patent #:	7867822	Issue Dt:	01/11/2011	Application #:	12618542	Filing Dt:	11/13/2009
Publication #:	US20100112753	Pub Dt:	05/06/2010
Title:	SEMICONDUCTOR MEMORY DEVICE

Patent #:	NONE	Issue Dt:		Application #:	12637559	Filing Dt:	12/14/2009
Publication #:	US20100133695	Pub Dt:	06/03/2010
Title:	ELECTRONIC CIRCUIT WITH EMBEDDED MEMORY

Patent #:	8723335	Issue Dt:	05/13/2014	Application #:	12847244	Filing Dt:	07/30/2010
Publication #:	US20110285027	Pub Dt:	11/24/2011
Title:	SEMICONDUCTOR CIRCUIT STRUCTURE AND METHOD OF FORMING THE SAME USING A CAPPING LAYER

Patent #:	8723335	Issue Dt:	05/13/2014	Application #:	12847244	Filing Dt:	07/30/2010
Publication #:	US20110285027	Pub Dt:	11/24/2011
Title:	SEMICONDUCTOR CIRCUIT STRUCTURE AND METHOD OF FORMING THE SAME USING A CAPPING LAYER

Patent #:	8455978	Issue Dt:	06/04/2013	Application #:	12847374	Filing Dt:	07/30/2010
Publication #:	US20110291234	Pub Dt:	12/01/2011
Title:	SEMICONDUCTOR CIRCUIT STRUCTURE AND METHOD OF MAKING THE SAME

Patent #:	8455978	Issue Dt:	06/04/2013	Application #:	12847374	Filing Dt:	07/30/2010
Publication #:	US20110291234	Pub Dt:	12/01/2011
Title:	SEMICONDUCTOR CIRCUIT STRUCTURE AND METHOD OF MAKING THE SAME

Patent #:	8071438	Issue Dt:	12/06/2011	Application #:	12874866	Filing Dt:	09/02/2010
Publication #:	US20110053332	Pub Dt:	03/03/2011
Title:	SEMICONDUCTOR CIRCUIT

Patent #:	NONE	Issue Dt:		Application #:	13175293	Filing Dt:	07/01/2011
Publication #:	US20120003815	Pub Dt:	01/05/2012
Title:	SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

Patent #:	9012292	Issue Dt:	04/21/2015	Application #:	13175652	Filing Dt:	07/01/2011
Publication #:	US20120003808	Pub Dt:	01/05/2012
Title:	SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

Patent #:	9012292	Issue Dt:	04/21/2015	Application #:	13175652	Filing Dt:	07/01/2011
Publication #:	US20120003808	Pub Dt:	01/05/2012
Title:	SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

Assignor

DAEHONG TECHNEW CORPORATION

Exec Dt:

04/27/2018

Assignee

BESANG INC.

1915 NW AMBERGLEN PARKWAY SUITE 400

BEAVERTON, OREGON 97006

Correspondence name and address
	J. ALFRED MURRAY, DAVIS WRIGHT TREMAINE
	1300 SW FIFTH AVENUE, SUITE 2400
	PORTLAND, OR 97201

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