Patent Assignment Details
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| Reel/Frame: | 060776/0353 | |
| Pages: | 4 |
| | Recorded: | 08/11/2022 | | |
| Attorney Dkt #: | 102351-1970-01727/US12446 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17877795
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Filing Dt:
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07/29/2022
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Publication #:
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Pub Dt:
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02/01/2024
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Title:
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SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Assignee
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| 26 CHIN 3RD ROAD, NANZIH DIST. |
| KAOHSIUNG, TAIWAN 811 |
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Correspondence name and address
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FOLEY & LARDNER LLP
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3000 K STREET, N.W.
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SUITE 600
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WASHINGTON, DC 20007
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06/04/2024 01:01 AM
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