Patent Assignment Details
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| Reel/Frame: | 050908/0357 | |
| Pages: | 7 |
| | Recorded: | 11/04/2019 | | |
| Attorney Dkt #: | 2449.026 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/11/2023
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Application #:
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16610756
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Filing Dt:
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11/04/2019
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Title:
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Electronic Expansion Valve, Thermal Management Assembly, Cooling System, and Method for Manufacturing Electronic Expansion Valve
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Assignee
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| NO. 301, 12TH STREET |
| HANGZHOU ECONOMIC & TECHNOLOGICAL DEVELOPMENT AREA |
| HANGZHOU, CHINA 310018 |
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Correspondence name and address
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BOYLE FREDRICKSON S.C.
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840 NORTH PLANKINTON AVENUE
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MILWAUKEE, WI 53203
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05/28/2024 07:49 PM
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