Patent Assignment Details
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Reel/Frame: | 007303/0359 | |
| Pages: | 2 |
| | Recorded: | 01/05/1995 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/10/1996
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Application #:
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08368847
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Filing Dt:
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01/05/1995
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Title:
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METHOD FOR PRODUCING ELECTROLESS BARRIER LAYER AND SOLDER BUMP ON CHIP
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Assignee
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HO-PING E. RD. |
FL. 18, NO. 106, SEC. 2 |
TAIPEI, TAIWAN R.O.C. |
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Correspondence name and address
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EVAN R. WITT
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MADSON & METCALF
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950 FIRST INTERSTATE PLAZA
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170 SO. MAIN STREET
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SALT LAKE CITY, UTAH 84101
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