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Reel/Frame:049981/0359   Pages: 6
Recorded: 08/06/2019
Attorney Dkt #:068293-649001US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/16/2021
Application #:
16533716
Filing Dt:
08/06/2019
Publication #:
Pub Dt:
05/28/2020
Title:
ELECTRONIC PACKAGE, METHOD FOR FABRICATING THE SAME, AND HEAT DISSIPATOR
Assignors
1
Exec Dt:
06/17/2019
2
Exec Dt:
06/17/2019
3
Exec Dt:
06/17/2019
4
Exec Dt:
06/17/2019
5
Exec Dt:
06/18/2019
6
Exec Dt:
06/18/2019
7
Exec Dt:
06/18/2019
8
Exec Dt:
06/18/2019
Assignee
1
NO. 123, SEC. 3, DA FONG ROAD
TANTZU, TAICHUNG, TAIWAN
Correspondence name and address
MINTZ LEVIN
ONE FINANCIAL CENTER
BOSTON, MA 02111

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