Patent Assignment Details
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| Reel/Frame: | 031344/0360 | |
| Pages: | 11 |
| | Recorded: | 10/04/2013 | | |
| Attorney Dkt #: | 25032US01 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE OF MICHAEL G. KELLY PREVIOUSLY RECORDED ON REEL 029311 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE MICHAEL G. KELLY EXECUTION DATE PREVIOUSLY RECORDED AS 01/08/2012 BUT SHOULD BE 11/08/2012. |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/26/2015
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Application #:
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13678046
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Filing Dt:
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11/15/2012
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Publication #:
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Pub Dt:
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05/15/2014
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Title:
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Method And System For A Semiconductor Device Package With A Die To Interposer Wafer First Bond
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Assignee
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| 1900 SOUTH PRICE ROAD |
| CHANDLER, ARIZONA 85286-6604 |
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Correspondence name and address
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MCANDREWS, HELD & MALLOY, LTD.
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500 WEST MADISON STREET
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34TH FLOOR
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CHICAGO, IL 60661
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