Patent Assignment Details
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| Reel/Frame: | 027395/0361 | |
| Pages: | 4 |
| | Recorded: | 12/15/2011 | | |
| Attorney Dkt #: | AIP.104 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/13/2013
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Application #:
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13325587
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Filing Dt:
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12/14/2011
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Publication #:
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Pub Dt:
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03/21/2013
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Title:
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BONDING METHOD FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT AND THREE-DIMENSIONAL INTEGRATED CIRCUIT THEREOF
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Assignee
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| NO. 1001, DAXUE RD. |
| EAST DIST. |
| HSINCHU CITY, TAIWAN 300 |
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Correspondence name and address
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JEFF LLOYD
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PO BOX 142950
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GAINESVILLE, FL 32614-2950
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