Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 035447/0366 | |
| Pages: | 13 |
| | Recorded: | 04/16/2015 | | |
| Attorney Dkt #: | 485352 |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
9
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Patent #:
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Issue Dt:
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09/28/2010
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Application #:
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11167858
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Filing Dt:
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06/27/2005
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Publication #:
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Pub Dt:
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01/26/2006
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Title:
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PRINTED CIRCUIT BOARD HAVING STRUCTURE FOR RELIEVING STRESS CONCENTRATION, AND SEMICONDUCTOR CHIP PACKAGE EQUIPPED WITH THE SAME
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Patent #:
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Issue Dt:
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10/23/2007
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Application #:
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11194285
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Filing Dt:
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08/01/2005
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Publication #:
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Pub Dt:
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10/19/2006
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Title:
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LEAD FRAME FOR SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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07/24/2012
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Application #:
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12156513
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Filing Dt:
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06/02/2008
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Publication #:
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Pub Dt:
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04/16/2009
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Title:
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METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD
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Patent #:
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Issue Dt:
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02/28/2012
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Application #:
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12288740
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Filing Dt:
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10/23/2008
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Publication #:
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Pub Dt:
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04/30/2009
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Title:
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A METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD (PCB)
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Patent #:
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Issue Dt:
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03/06/2012
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Application #:
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12317562
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Filing Dt:
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12/23/2008
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Publication #:
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Pub Dt:
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06/25/2009
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Title:
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ROLL-TO-ROLL SUBSTRATE TRANSFER APPARATUS, WET ETCHING APPARATUS COMPRISING THE SAME AND APPARATUS FOR MANUFACTURING PRINTED CIRCUIT BOARD
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Patent #:
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Issue Dt:
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10/02/2012
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Application #:
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12432898
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Filing Dt:
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04/30/2009
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Publication #:
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Pub Dt:
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11/19/2009
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Title:
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CIRCUIT BOARD VIAHOLES AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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04/02/2013
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Application #:
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12475764
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Filing Dt:
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06/01/2009
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Publication #:
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Pub Dt:
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05/13/2010
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Title:
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PRINTED CIRCUIT BOARD WITH MULTIPLE METALLIC LAYERS AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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04/30/2013
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Application #:
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12492382
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Filing Dt:
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06/26/2009
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Publication #:
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Pub Dt:
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01/07/2010
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Title:
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CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13542233
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Filing Dt:
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07/05/2012
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Publication #:
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Pub Dt:
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11/08/2012
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Title:
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CIRCUIT BOARD VIAHOLES AND METHOD OF MANUFACTURING THE SAME
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Assignee
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| 726, UNGNAM-RO, SEONGSAN-GU |
| CHANGWON-SI, GYEONGSANGNAM-DO, KOREA, REPUBLIC OF 642-120 |
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Correspondence name and address
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BRIAN C. RUPP, DRINKER BIDDLE & REATH
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191 N. WACKER DRIVE
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SUITE 3700
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CHICAGO, IL 60606-1698
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