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Patent Assignment Details
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Reel/Frame:066305/0366   Pages: 3
Recorded: 01/15/2024
Attorney Dkt #:S923L14662/14664
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 2
1
Patent #:
Issue Dt:
02/21/2012
Application #:
12565298
Filing Dt:
09/23/2009
Publication #:
Pub Dt:
03/25/2010
Title:
WAFER BONDING METHOD AND WAFER STACK FORMED THEREBY
2
Patent #:
Issue Dt:
09/30/2014
Application #:
13404056
Filing Dt:
02/24/2012
Publication #:
Pub Dt:
11/15/2012
Title:
PROCESSES AND MOUNTING FIXTURES FOR FABRICATING ELECTROMECHANICAL DEVICES AND DEVICES FORMED THEREWITH
Assignor
1
Exec Dt:
12/21/2023
Assignee
1
100 OVERLOOK CENTER, 2ND FLOOR
PRINCETON, NEW JERSEY 08540
Correspondence name and address
ALLIED SECURITY TRUST
100 OVERLOOK CENTER
2ND FLOOR
PRINCETON, NJ 08540

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