Patent Assignment Details
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Reel/Frame: | 048604/0371 | |
| Pages: | 3 |
| | Recorded: | 03/14/2019 | | |
Attorney Dkt #: | PLS19305PCTUS |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/16/2021
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Application #:
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16333584
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Filing Dt:
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03/14/2019
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Publication #:
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Pub Dt:
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08/22/2019
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Title:
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ROUND CHIP SCALE PACKAGE AND MANUFACTURING METHOD THEREFOR
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Assignee
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#303, MEMSNANO PARTS PRODUCTION CENTER IN PUSAN NATIONAL UNIVERSITY |
2-1, BUSANDAEHAK-RO 63BEON-GIL GEUMJEONG-GU |
BUSAN, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 46239 |
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Correspondence name and address
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MCCOY RUSSELL LLP
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806 SW BROADWAY
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SUITE 600
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PORTLAND, OR 97205-3335
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