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Reel/Frame:056571/0371   Pages: 11
Recorded: 06/17/2021
Attorney Dkt #:2104010/1173-720
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17237828
Filing Dt:
04/22/2021
Publication #:
US20220344250
Pub Dt:
10/27/2022
Title:
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, REDISTRIBUTION LAYER (RDL) SUBSTRATE FOR INTERFACING AN IC CHIP(S) TO A PACKAGE SUBSTRATE, AND RELATED METHODS
Assignors
1
CHOI, JIHONG
Exec Dt:
05/19/2021
2
NALLAPATI, GIRIDHAR
Exec Dt:
06/16/2021
3
STONE, WILLIAM
Exec Dt:
05/12/2021
4
XU, JIANWEN
Exec Dt:
05/12/2021
5
KIM, JONGHAE
Exec Dt:
05/03/2021
6
CHIDAMBARAM, PERIANNAN
Exec Dt:
05/14/2021
7
SYED, AHMER
Exec Dt:
05/27/2021
Assignee
1
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE
SAN DIEGO, CALIFORNIA 92121
Correspondence name and address
W&T/QUALCOMM
106 PINEDALE SPRINGS WAY
CARY, NC 27511

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