Patent Assignment Details
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Reel/Frame: | 012447/0372 | |
| Pages: | 4 |
| | Recorded: | 05/28/1999 | | |
Conveyance: | CORRECTION OF STATE OF INCORPORATION OF ASSIGNMENT RECORDED AT REEL 010015 FRAME 0543 ON D/28/1999 |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/21/2001
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Application #:
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09322638
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Filing Dt:
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05/28/1999
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Title:
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BOND PAD SEALING USING WIRE BONDING
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Assignee
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2900 SEMICONDUCTOR DRIVE |
SANTA CLARA, CALIFORNIA 95051 |
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Correspondence name and address
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BEYER & WEAVER & THOMAS LLP
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STEVEN D BEYER
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P.O. BOX 778
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BERKELEY, CA 94704-0778
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