Patent Assignment Details
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| Reel/Frame: | 022563/0372 | |
| Pages: | 3 |
| | Recorded: | 04/17/2009 | | |
| Attorney Dkt #: | 8753P005 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/09/2012
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Application #:
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12424514
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Filing Dt:
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04/15/2009
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Publication #:
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Pub Dt:
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08/05/2010
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Title:
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WAFER LEVEL PACKAGE FOR HEAT DISSIPATION AND METHOD OF MANUFACTURING THE SAME
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Assignee
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| 314, MAETAN 3-DONG, YEONGTONG-GU, SUWON |
| GYUNGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 443-743 |
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Correspondence name and address
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ROBERT B. O'ROURKE
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1279 OAKMEAD PARKWAY
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SUNNYVALE, CA 94085
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