Patent Assignment Details
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Reel/Frame: | 020447/0373 | |
| Pages: | 4 |
| | Recorded: | 01/25/2008 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11989453
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Filing Dt:
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01/25/2008
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Publication #:
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Pub Dt:
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07/02/2009
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Title:
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Solder Mounting Structure, Method for Manufacturing Such Solder Mounting Structure and Use of Such Solder Mounting Structure
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Assignee
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22-22, NAGAIKE-CHO |
ABENO-KU, OSAKA-SHI, |
OSAKA, JAPAN 545-8522 |
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Correspondence name and address
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DAVID G. CONLIN
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EDWARDS ANGELL PALMER & DODGE, LLP
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P.O. BOX 55874
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BOSTON, MA 02205
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06/01/2024 01:05 AM
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